3D InCites - Deca Technologies Sees Promise in FOWLP for...

January 14, 2016

According to TechSearch International, we can expect to see 87% CAGR for fan-out wafer-level packages (FOWLP) over the coming 3 years. This demand is driven by a combination of several factors. Read full article

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3D InCites - Could Virtual SoCs built using FOWL...

For quite some time on 3D InCites, we’ve talked about how breaking up SoC designs into specific functions not only offers a lower cost of...

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