Deca Technologies is an emerging wafer-level interconnect foundry built upon 10X thinking; the philosophy of striving to achieve exponential improvements over typical industry methods. Deca’s unique approach to design, equipment, processes and operational methods delivers our customers a competitive edge with short cycle time and rapid new product introduction.
July 12, 2019
The purpose of this article is to provide insight into why Deca’s Fan-Out Technology has recently been adopted by Qualcomm as a protection layer for its PMIC Fan-in Wafer-Level-Packaging (WLP) die. View Full Article
Higher density fan-out packages are moving toward more complex structures with finer routing layers, all of which requires more capable lithography equipment and other tools....