Semiconductor Engineering - Packaging Wars Begin

October 4, 2016

The advanced IC-packaging market is turning into a high-stakes competitive battleground, as vendors ramp up the next wave of 2.5D/3D technologies, high-density fan-out packages and others. View Full Article  

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I-micronews.com – Fan-out Packaging: The Most ...

2016 is a turning point for the Fan-Out market since both leaders, Apple and TSMC changed the game and may create a trend of acceptance...

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