3D InCites - The IWLPC Fan-out PLP Smack Down

November 4, 2019

At IWLPC 2019, the fan-out panel-level packaging (PLP) debate continued in another of Jan Vardaman’s famous lively panel discussions, which was co-moderated by PLP technology expert, Tanja Braun, Fraunhofer IZM. Panelists were John Hunt, ASE;...

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Semiconductor Engineering - M-Series Multi Site ...

Packaging and test In a major deal that has some implications in the OSAT supply chain, South Korea’s Nepes has taken over Deca Technologies’ wafer-level...

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