Cypress Subsidiary Deca Technologies to Receive $60 Mil...

April 28, 2016

ASE Licenses Deca’s M-Series™ Fan-out Wafer-Level Packaging Technology; Agreement Expands the Manufacturing of Miniaturized Semiconductor Packages for Smartphones and IoT   SAN JOSE, Calif., April 28, 2016 – Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE:...

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3D InCites - Deca Technologies Sees Promise in F...

According to TechSearch International, we can expect to see 87% CAGR for fan-out wafer-level packages (FOWLP) over the coming 3 years. This demand is driven...

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