3D InCites - Deca FOWLP is Going Mainstream

September 16, 2019

Deca Technologies has confirmed that its M-Series™ fan-out wafer-level packaging (FOWLP) technology has been adopted by Qualcomm for power management integrated circuit (PMIC) devices in Samsung’s S10, the Xiaomi Mi 9 and LG G8 smartphones View Full...

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I-micronews.com – New commercialization of Dec...

The purpose of this article is to provide insight into why Deca’s Fan-Out Technology has recently been adopted by Qualcomm as a protection layer for...

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