3D InCites – Tim Olson Talks About Deca’s Approach t...

December 22, 2016

Deca’s secret sauce to high yields enabling fan-out system on chip (FO SoC) is its proprietary adaptive patterning/adaptive alignment processes, which resolves the die shift problem by aligning RDL pattern to the measured die position. It enables high metal density designs and precisely aligns inductors to the die.

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Semiconductor Engineering - Packaging Wars Begin

The advanced IC-packaging market is turning into a high-stakes competitive battleground, as vendors ramp up the next wave of 2.5D/3D technologies, high-density fan-out packages and...

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