Deca Technologies is an emerging wafer-level interconnect foundry built upon 10X thinking; the philosophy of striving to achieve exponential improvements over typical industry methods. Deca’s unique approach to design, equipment, processes and operational methods delivers our customers a competitive edge with short cycle time and rapid new product introduction.
Staying competitive in the WLCSP market is all about time. While your competitors are still waiting for new mask sets to start a product build, Deca’s 10X approach is already rolling your product off its Autoline.
Breaking through traditional cost, yield and supply chain barriers, Deca’s M-Series™ molded fan-out technology with Adaptive Patterning™ sets the stage for cost-effective high-density electronic interconnect. From next-generation single-chip packages to future panel level SoCs built from disparate silicon blocks, the unique M-Series structure frees system designers from classic substrate-based methods and the confines of monolithic silicon. Major Industry Validation for M-Series
December 22, 2016
Deca’s secret sauce to high yields enabling fan-out system on chip (FO SoC) is its proprietary adaptive patterning/adaptive alignment processes, which resolves the die shift problem by aligning RDL pattern to the measured die position. It enables high metal density designs and precisely aligns inductors to the die.
The advanced IC-packaging market is turning into a high-stakes competitive battleground, as vendors ramp up the next wave of 2.5D/3D technologies, high-density fan-out packages and...