I-micronews.com – New commercialization of Deca Techno...

July 12, 2019

The purpose of this article is to provide insight into why Deca’s Fan-Out Technology has recently been adopted by Qualcomm as a protection layer for its PMIC Fan-in Wafer-Level-Packaging (WLP) die. View Full Article

Read more

Semiconductor Engineering – Lithography Challe...

Higher density fan-out packages are moving toward more complex structures with finer routing layers, all of which requires more capable lithography equipment and other tools....

Read more