3D InCites – Tim Olson Talks About Deca’s Approach to Fan-Out System on Chip (FO SoC) at 3D ASIP

Deca’s secret sauce to high yields enabling fan-out system on chip (FO SoC) is its proprietary adaptive patterning/adaptive alignment processes, which resolves the die shift problem by aligning RDL pattern to the measured die position. It enables high metal density designs and precisely aligns inductors to the die.

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