3D InCites – The IWLPC Fan-out PLP Smack Down
At IWLPC 2019, the fan-out panel-level packaging (PLP) debate continued in another of Jan Vardaman’s famous lively panel discussions, which was co-moderated by PLP technology expert, Tanja Braun, Fraunhofer IZM. Panelists were John Hunt, ASE; Joseph Dang, AT&S; Keith Best, Rudolph Technologies; Tim Olson, Deca Technologies.
Fan-out PLP (FO PLP) has been a hot topic on the conference circuit for a number of years, and we’ve been following its progress. According to JCET CTO, Choon Huang Lee, PLP may be the answer to yield and cost for emerging heterogeneous integration solutions like high-density fan-out (HDFO) and chiplet integration.
Deca’s Tim Olson says he’s been a believer in FO “before it was cool” and worked to bring innovation to it. Since the beginning, he’s worked to bring FO to large-panel format, and with ASE’s investment in 2016, it has helped bring it close to reality.