3D InCites – Transforming the Fan-out Landscape

These days, the first thing that comes to mind when someone mentions fan-out (FO) technology is Apple’s A10 processor built on TSMCs integrated fan-out (InFO) technology. It’s the superstar application that put FO on the map and into high volume manufacturing.

However, equally important to remember are the numerous low-density FO workhorses supporting other mobile applications, as well as markets beyond mobile. They come in a variety of acronyms from all the leading outsourced semiconductor assembly and test service providers (eWLB, SWIFT, eSiFO, ECP, RCP, TPI-FO, etc). One technology stands out for, among other things, not having an acronym-based name: Deca Technologies’ M-Series.

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