Bernard Adams is vice president of Business Development for Deca Technologies. His focus is the global mass adoption of the M-Series fan-out product line.
From October 2016 to May 2018, Adams directed sales at the Qualcomm account for STATS ChipPAC, a JCET company. He was responsible for several hundred million dollars in annual sales revenue, managing all facets of the relationship leading a cross- functional San Diego-based team. Products were produced in Singapore, Taiwan, Korea and Jiangyin, China. From July 2013 to October 2016, Adams was director of marketing, Qualcomm Account, for STATS ChipPAC. In this role, he led the Advanced Wafer Level business, driving the industry to adopt the new eWLB fan-out technology through customer adoption, papers, conferences and digital media.
Earlier, Adams was VP North American Sales, Leica Microsystems. He was recruited to change the culture in the North American sales organization into a proactive “global tiger.” Adams’ success in the face of this challenge produced hundreds of millions of dollars for the company.
His first semiconductor position, director worldwide sales, was at Flip Chip Technologies, a joint venture of General Motors and Kulicke & Soffa. Adams’ management training was at Rockwell International, Allen-Bradley division.
He holds an EMBA from the University of Pittsburgh and a B.S in electrical engineering from Purdue University.