Technology Papers

Enabling the Fan-out SiP

Presented by Deca’s Chris Scanlan, Vice President of Product Management & Engineering, at the 14th Annual 3D ASIP Conference in San Francisco, California on Thursday, December 7, 2017. 3D ASIP Presentation: Enabling the...

ADAPTIVE PATTERNING FOR PANELIZED PACKAGING

By Chris Scanlan, vice president, product management, Deca Technologies, Inc. Abstract: Fan-Out Wafer-Level Packaging (FOWLP) or fan-out technology has held promise for a number of years; primarily as a means...