Deca Positions For Ramp; Names Iain Meikle As Managing Director Of Philippines Operations
Tempe, AZ. — August 16 2012 – Deca Technologies, an electronic interconnect solutions provider offering wafer level packaging (WLP) services to the semiconductor industry, announced today a strategic expansion of its executive management team with the appointment of Iain Meikle as Vice President of Operations and Managing Director of the Company’s Philippines operations.
Reporting directly to President and CEO Tim Olson, Meikle brings a wealth of experience with almost three decades in the semiconductor industry in senior leadership roles within engineering, operations and sales. He joins Deca from Carsem where he served as Vice President of Manufacturing, overseeing operations at factories in Malaysia and China.
Since its launch in November 2011, Deca has been steadily ramping up operations within its Philippines manufacturing base. “We are generating significant interest in our breakthrough new product capabilities, our unique flexibility and our compelling cost of ownership,” commented Olson. “Currently, we are qualified in over a dozen applications and are actively engaged with several industry-leading customers. Our focus remains on preparations to support significant growth in 2013 and beyond. Iain’s strong background is a great fit with our desire to serve our customers through exceptional operational performance. We look forward to Iain’s leadership in our next phase of growth”
Originally from Scotland, Meikle has been working in the Asia Pacific region for over 18 years. Initially based in Hong Kong and more recently in Malaysia, he has held positions with Dynacraft Industries, a leading player in the lead-frame industry, where he was Chief Operating Officer for six years; GEC Plessy Semiconductors, Seagate’s semiconductor division; and Burr Brown semiconductors. Meikle holds a Bachelor of Science Degree in Mechanical and Production engineering from the Kirkaldy College of Technology, affiliated to Strathclyde University, Scotland.
About Deca Technologies
Founded in 2009 and launched in November 2011, Deca Technologies is an electronic interconnect solutions provider offering wafer level packaging (WLP) services to the semiconductor industry. Headquartered in Tempe, AZ and with global capabilities, Deca is a majority-owned and fully independent subsidiary of Cypress Semiconductor Corp. (NASDAQ: CY). Deca’s mission is to deliver an exceptional customer experience through its proprietary and transformative interconnect technology.
Integrating its solar and semiconductor background, Deca leverages unique equipment, processes and operational methods to break down traditional barriers in the continued adoption and growth of next generation wafer level electronic interconnect.
For more information, please visit http://www.decatechnologies.com/
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