Staying competitive in today’s rapidly growing wafer-level chip scale package (WLCSP) market is all about time:
- Time to market
- Time to response
- Time for new technologies
While your competitors are still waiting for new mask sets to start a product build, Deca’s 10X approach is already rolling your new WLSCP product of its Autoline.
Consumer electronics manufacturers demand low-cost WLCSP devices with rapid turnaround from design to delivery, which poses a challenge when using conventional approaches. Time-to-ramp for new product introductions is critical, as is dynamic manufacturing capability from the WLCSP supply base.
At Deca, you’ll experience 24-hour NPI with 3 days in production. Our proprietary Autoline manufacturing process significantly reduces cycle time, so customers can respond quickly to market demand swings and hold a first-to-market competitive edge.