News and Papers
In Deca in the News
According to the market research firm, Yole Développement, “the demand for lower cost plus higher performance, coupled with OSAT/assembly house end-customers’ desire for increasingly lower prices, has driven the semiconductor industry...
In Deca in the News
The 2018 3DInCites Awards recognize industrywide achievements in the development of heterogeneous integration technologies with categories from Research Institute of the Year to Materials Supplier of the Year.
In Technology Papers
Presented by Deca’s Chris Scanlan, Vice President of Product Management & Engineering, at the 14th Annual 3D ASIP Conference in San Francisco, California on Thursday, December 7, 2017. 3D ASIP Presentation: Enabling the...
In Deca in the News
Deca’s secret sauce to high yields enabling fan-out system on chip (FO SoC) is its proprietary adaptive patterning/adaptive alignment processes, which resolves the die shift problem by aligning RDL pattern to the measured die position. It enables high metal density designs and precisely aligns inductors to the die.
In Deca in the News
The advanced IC-packaging market is turning into a high-stakes competitive battleground, as vendors ramp up the next wave of 2.5D/3D technologies, high-density fan-out packages and others. View Full Article
In Press Releases
TEMPE, Arizona – September 1, 2016 – Deca Technologies, a wafer level electronic interconnect solutions provider to the semiconductor industry, announced today the receipt of an additional $51.5 million investment...
In Deca in the News
2016 is a turning point for the Fan-Out market since both leaders, Apple and TSMC changed the game and may create a trend of acceptance of Fan-Out packages. View Full...
In Deca in the News
Printed Circuit Design & Fab Online Magazine – FO-WLP Steals the Show at ECTC (Download the PDF)
In Deca in the News
In Press Releases,
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ASE Licenses Deca’s M-Series™ Fan-out Wafer-Level Packaging Technology; Agreement Expands the Manufacturing of Miniaturized Semiconductor Packages for Smartphones and IoT SAN JOSE, Calif., April 28, 2016 – Advanced Semiconductor...
