News and Papers

Press Releases

Deca Partners with ADTEC Engineering to Enhance Adaptive Patterning™ for 2µm Chiplet Scaling

Deca in the News

Semiconductor Engineering: Planning For Panel-Level Fan-Out

Deca in the News

3D InCites: The IWLPC Fan-out PLP Smack Down

Deca in the News

Semiconductor Engineering: M-Series Multi Site Capability

Press Releases

nepes corporation to acquire Deca Technologies manufacturing operations

Deca in the News

3D InCites: Deca FOWLP is Going Mainstream

Press Releases

Advanced Fan-out Technology Breakthrough: Deca Technologies’ M-Series™ Identified in Samsung S10, Xiaomi Mi 9 and LG G8 Handsets

Deca in the News

I-micronews.com: New commercialization of Deca Technologies’ Fan-Out technology

Deca in the News

Semiconductor Engineering: Lithography Challenges For Fan-Out

Technology Papers

Adaptive Patterning™- Creating A System To Balance Natural Variation

Technology Papers

A Paradigm Shift Through Panel Level Processing

Press Releases

Mentor adds DECA Technologies to growing Mentor OSAT Alliance for high density advanced package (HDAP) designs