News and Papers
In Deca in the News
At IWLPC 2019, the fan-out panel-level packaging (PLP) debate continued in another of Jan Vardaman’s famous lively panel discussions, which was co-moderated by PLP technology expert, Tanja Braun, Fraunhofer IZM....
In Deca in the News
Packaging and test In a major deal that has some implications in the OSAT supply chain, South Korea’s Nepes has taken over Deca Technologies’ wafer-level packaging manufacturing line in the...
In Press Releases
Tempe (AZ)- October 1st- Deca Technologies is pleased to announce that it has reached an agreement with nepes corporation (nepes) whereby nepes will expand its geographic footprint and manufacturing capabilities...
In Deca in the News
Deca Technologies has confirmed that its M-Series™ fan-out wafer-level packaging (FOWLP) technology has been adopted by Qualcomm for power management integrated circuit (PMIC) devices in Samsung’s S10, the Xiaomi Mi 9 and...
In Press Releases
Deca Technologies, a wafer-level electronic interconnect solutions provider to the semiconductor industry, today announced that Industry researchers Yole and TechInsights have independently confirmed that M-Series™ fan-out wafer-level packaging (FOWLP) technology created by Deca Technologies has been adopted by Qualcomm
In Deca in the News
The purpose of this article is to provide insight into why Deca’s Fan-Out Technology has recently been adopted by Qualcomm as a protection layer for its PMIC Fan-in Wafer-Level-Packaging (WLP)...
In Deca in the News
Higher density fan-out packages are moving toward more complex structures with finer routing layers, all of which requires more capable lithography equipment and other tools. The latest high-density fan-out packages...
In Technology Papers
Presented by Deca’s Tim Olson, Chief Technology Officer, at the Industry Strategy Symposium–ISS 2019 which took place in January at The Ritz Carlton Half Moon Bay, California. Adaptive Patterning™- Creating...
In Technology Papers
Presented by Deca’s Garry Pycroft, Vice President of Sales & Marketing, at SEMI’s 3D & Systems Summit which took place January 2019 in Dresden, Germany. A Paradigm Shift Through Panel...
In Press Releases
Mentor, a Siemens business, today announced that DECA Technologies has become the latest member of Mentor’s (outsourced assembly and test) OSAT Alliance – a program to help drive faster adoption of new,...
