News and Papers
In Deca in the News
Higher density fan-out packages are moving toward more complex structures with finer routing layers, all of which requires more capable lithography equipment and other tools. The latest high-density fan-out packages...
In Technology Papers
Presented by Deca’s Tim Olson, Chief Technology Officer, at the Industry Strategy Symposium–ISS 2019 which took place in January at The Ritz Carlton Half Moon Bay, California. Adaptive Patterning™- Creating...
In Technology Papers
Presented by Deca’s Garry Pycroft, Vice President of Sales & Marketing, at SEMI’s 3D & Systems Summit which took place January 2019 in Dresden, Germany. A Paradigm Shift Through Panel...
In Press Releases
Mentor, a Siemens business, today announced that DECA Technologies has become the latest member of Mentor’s (outsourced assembly and test) OSAT Alliance – a program to help drive faster adoption of new,...
In Deca in the News
These days, the first thing that comes to mind when someone mentions fan-out (FO) technology is Apple’s A10 processor built on TSMCs integrated fan-out (InFO) technology. It’s the superstar application...
In Deca in the News
According to the market research firm, Yole Développement, “the demand for lower cost plus higher performance, coupled with OSAT/assembly house end-customers’ desire for increasingly lower prices, has driven the semiconductor industry...
In Deca in the News
The 2018 3DInCites Awards recognize industrywide achievements in the development of heterogeneous integration technologies with categories from Research Institute of the Year to Materials Supplier of the Year.
In Technology Papers
Presented by Deca’s Chris Scanlan, Vice President of Product Management & Engineering, at the 14th Annual 3D ASIP Conference in San Francisco, California on Thursday, December 7, 2017. 3D ASIP Presentation: Enabling the...
In Deca in the News
Deca’s secret sauce to high yields enabling fan-out system on chip (FO SoC) is its proprietary adaptive patterning/adaptive alignment processes, which resolves the die shift problem by aligning RDL pattern to the measured die position. It enables high metal density designs and precisely aligns inductors to the die.
In Deca in the News
The advanced IC-packaging market is turning into a high-stakes competitive battleground, as vendors ramp up the next wave of 2.5D/3D technologies, high-density fan-out packages and others. View Full Article
