News and Papers
In Deca in the News
Deca’s secret sauce to high yields enabling fan-out system on chip (FO SoC) is its proprietary adaptive patterning/adaptive alignment processes, which resolves the die shift problem by aligning RDL pattern to the measured die position. It enables high metal density designs and precisely aligns inductors to the die.
In Deca in the News
The advanced IC-packaging market is turning into a high-stakes competitive battleground, as vendors ramp up the next wave of 2.5D/3D technologies, high-density fan-out packages and others. View Full Article
In Press Releases
TEMPE, Arizona – September 1, 2016 – Deca Technologies, a wafer level electronic interconnect solutions provider to the semiconductor industry, announced today the receipt of an additional $51.5 million investment...
In Deca in the News
2016 is a turning point for the Fan-Out market since both leaders, Apple and TSMC changed the game and may create a trend of acceptance of Fan-Out packages. View Full...
In Deca in the News
Printed Circuit Design & Fab Online Magazine – FO-WLP Steals the Show at ECTC (Download the PDF)
In Deca in the News
In Press Releases,
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ASE Licenses Deca’s M-Series™ Fan-out Wafer-Level Packaging Technology; Agreement Expands the Manufacturing of Miniaturized Semiconductor Packages for Smartphones and IoT SAN JOSE, Calif., April 28, 2016 – Advanced Semiconductor...
In Deca in the News
According to TechSearch International, we can expect to see 87% CAGR for fan-out wafer-level packages (FOWLP) over the coming 3 years. This demand is driven by a combination of several...
In Deca in the News
For quite some time on 3D InCites, we’ve talked about how breaking up SoC designs into specific functions not only offers a lower cost of ownership than continued scaling, but...
In Technology Papers
Presented by Debbie Claire Sanchez, Deca Technologies Fan-Out Wafer-Level Packaging (FOWLP) is poised to become a mainstream packaging technology, providing a means of packaging semiconductor chips with interconnect densities...
