News and Papers

These days, the first thing that comes to mind when someone mentions fan-out (FO) technology is Apple’s A10 processor built on TSMCs integrated fan-out (InFO) technology. It’s the superstar application...

According to the market research firm,  Yole Développement, “the demand for lower cost plus higher performance, coupled with OSAT/assembly house end-customers’ desire for increasingly lower prices, has driven the semiconductor industry...

The 2018 3DInCites Awards recognize industrywide achievements in the development of heterogeneous integration technologies with categories from Research Institute of the Year to Materials Supplier of the Year.

Deca’s secret sauce to high yields enabling fan-out system on chip (FO SoC) is its proprietary adaptive patterning/adaptive alignment processes, which resolves the die shift problem by aligning RDL pattern to the measured die position. It enables high metal density designs and precisely aligns inductors to the die.

The advanced IC-packaging market is turning into a high-stakes competitive battleground, as vendors ramp up the next wave of 2.5D/3D technologies, high-density fan-out packages and others. View Full Article  

2016 is a turning point for the Fan-Out market since both leaders, Apple and TSMC changed the game and may create a trend of acceptance of Fan-Out packages. View Full...

Printed Circuit Design & Fab Online Magazine – FO-WLP Steals the Show at ECTC (Download the PDF)