Timothy L. Olson founded Deca Technologies in 2009 with a mission to transform the way the world creates advanced electronic products. Currently CEO, he has also served as CTO, while continuously serving as a director on the board.
Throughout his career, Tim led multiple breakthrough innovations and established industry processes. As Senior VP of Amkor Technology, he led global research and development, introducing Package on Package Through Mold Via (PoP TMV*) technology, FusionQuad* and the industry’s first high-volume fine pitch Cu pillar flip chip on laminate technology. Tim also led the creation of Amkor’s micro-EMS model, which established direct technology and business relationships with leading electronic systems OEMs to provide system-in-package modules and other advanced electronic interconnect solutions.
Tim began his semiconductor career at Motorola, where he led the creation, implementation and high-volume production operation of PRISM, a highly automated and integrated packaging and testing factory serving leading automotive and cellular OEMs. Under his leadership, semiconductor strip test technology was pioneered with the industry’s first production implementation.
In subsequent years at Fico (Besi), Tim established the Systems Integration Division, where this strip testing technology breakthrough was commercialized into the semiconductor industry for leadframe and laminate-based products. Through the sale of the Fico division to Micro Component Technology (MCT), he was appointed Executive VP of Products and Operations. During this time, MCT established itself as the world leader in strip test technology as well as related factory automation software and systems
Tim graduated magna cum laude from the University of North Dakota with bachelor’s degrees in mechanical engineering and engineering management. He holds more than 25 patents relating to wafer-level processing, fan-out and other packaging, adaptive patterning, factory automation software, design systems, processes and equipment. Tim also served as chairman of the SEMI International Test Assembly & Packaging committee and annual conference.
*TMV and FusionQuad are trademarks of Amkor.