Yole Développement – Status of Panel Level Packaging 2018

According to the market research firm,  Yole Développement, “the demand for lower cost plus higher performance, coupled with OSAT/assembly house end-customers’ desire for increasingly lower prices, has driven the semiconductor industry to develop innovative solutions. One approach to reducing overall cost is to switch from wafer and strip-level to a larger-size panel format that takes advantage of efficiency and economies of scale…”

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Status of Panel Level Packaging 2018
Apr.2018 (Source: Yole Développement)